Semiconductor module



FIG. 1 is a front, top and left side perspective view of a firstembodiment of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and right side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is an enlarged cross-sectional view at the portion of 8-8 takenalong line 8-8 in FIG. 5;

FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG.5;

FIG. 10 is a front, top and left side perspective view of a secondembodiment of a semiconductor module showing our new design;

FIG. 11 is a rear, bottom, and right side perspective view thereof;

FIG. 12 is a front view thereof;

FIG. 13 is a rear view thereof;

FIG. 14 is a top plan view thereof;

FIG. 15 is a bottom plan view thereof;

FIG. 16 is a left side view thereof;

FIG. 17 is an enlarged cross-sectional view at the portion of 17-17taken along line 17-17 in FIG. 14; and,

FIG. 18 is an enlarged cross-sectional view taken along line 18-18 inFIG. 14.

The broken lines illustrate portions of the semiconductor module andform no part of the claimed design. The dash-dotted lines denote theboundary of the claim and form no part of the claimed design.

CLAIM The ornamental design for a semiconductor module, as shown anddescribed.